The semiconductor packaging industry has been looking for lead-free alternative solutions for die attachments especially for high-power packages. One alternative, pressureless silver sinter interconnect, appears to be too brittle. The research question of this assignment is: can additives reduce brittleness and what are the optimal shapes and sizes of such additive materials to improve conductivity and still maintain similar mechanical properties?

Objective

• To conduct a characterization study to understand the influence of additives in terms of electrical, thermal and mechanical reliability

Internship and MSc thesis details

• Location: Nijmegen, the Netherlands
• Collaborators: CITC and TU Delft
• Duration: 6 – 8 months
• Requirements: current MSc students in Mechanical or Electrical Engineering
• Supervisors: Henry Antony Martin (PhD candidate) and Noud Schoenmakers (PhD candidate)
• Internship stipend: to be discussed