The future starts here! Are you ready to join NXP in Package Innovation?

The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application. Together with the Business Lines and end customers we develop the packages for the systems of the future!

Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.

The Package Innovation Modelling team uses Finite Element Simulation methodologies to shorten development cycles and deliver optimized design solutions for semiconductor packages. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures containing many non-linearities.

To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Nijmegen, the Netherlands. Your role is to develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming at a first-time right product qualification.

Your responsibilities

• Be a part of the on-site Package Innovation simulation team Nijmegen (NXP Netherlands) and collaboratively solve engineering questions for package development projects.

• Collaborate with Business Lines and System Teams to develop meaningful models for reliable system solutions.

• Support problem-solving of package related issues during lifetime testing and qualification.

• The engineer will be expected to drive package design with modelling insights and to support new concept development.

Your team

The modelling team’s responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in Nijmegen. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.

Your profile

To be successful in this role you have:

• A Master degree qualified in Mechanical, Aerospace or Materials Engineering or equivalent is required

• Proven experience with non-linear Finite Element Modelling, preferably Marc Mentat

• Fluent in English, basic proficiency in Dutch is considered valuable but not mandatory. All written communication is in English

• Basic understanding of semiconductor package technologies and package Bill of Material is required.

• Familiarity with reliability engineering and typical package/PCB failure modes is not required but considered a bonus.

• Proficiency in Python coding and/or Fortran is a pre. Basic Java is optional

​Furthermore, you are:

• An excellent communicator, teamplayer, influencer and networker.

• A self-starter with initiative & flexibility.

• Capable of planning your project(s) and aligning with (internal) stakeholders on timelines, requirements and required inputs.

More information about NXP in the Netherlands...