At PhotonFirst, we build the bridge between photonic innovation and real-world impact. Our technologies cover both photonic integrated circuit (PIC) packaging and Fiber Optic sensing, enabling customers to deploy highly reliable systems in some of the world’s most demanding environments; from aerospace and defense to quantum applications.

As the photonics ecosystem is rapidly evolving, both PIC packaging and Fiber Optic sensing are becoming critical enablers for scaling next-generation systems. PhotonFirst is at the forefront of this transition, combining photonics expertise with a pragmatic, engineering-driven approach to bring complex systems into operation.

The role

As the Business Development Manager PIC Packaging, you take ownership of a strategic growth area within PhotonFirst, with high impact. It’s a new role within the team, created to accelerate our growth in this area. You will work closely with our PIC Packaging Lead, Sales Engineer and the Commercial Team.

Your key activities include:

• Identify and develop new business opportunities for PIC packaging services
• Build and manage a strong pipeline of opportunities and strategic accounts
• Engage early in customer design cycles to position PhotonFirst as the preferred “design-in” packaging partner
• Translate complex technical requirements into clear commercial proposals together with engineering teams
• Develop and maintain strategic partnerships across the photonics ecosystem (foundries, designers, integrators, OEMs)
• Identify and pursue funding opportunities (EU, ESA, national programs) and contribute to joint proposals with partners
• Act as the linking pin between customers, partners and internal engineering teams