Join SMART Photonics B.V., a leading Indium Phosphide (InP) photonic foundry, where we work closely with customers to turn innovative ideas into high-performance photonic integrated circuits (PICs).

As demand for backend services, including wafer finishing, assembly, packaging, and testing, continues to grow, we are expanding our Product & Integration Engineering (PIE) team with expertise in packaging and reliability. This team plays a crucial role in bridging frontend wafer fabrication with internal backend processes and reliability testing as well as with backend, packaging and testing executed with external partners.

Your role:

As a Senior Integration Engineer, you will be at the center of this effort, ensuring seamless integration across the full value chain, with a strong focus on packaging and reliability. You act as a key technical link between internal teams and external partners, driving alignment, manufacturability, and performance of our integrated photonic products.

Serve as the subject matter expert on backend processes, packaging, and reliability requirements for PICs, resolving integration challenges across the value chain

Collaborate with Backend, New Product Introduction (NPI), Test, and Reliability Engineering teams, as well as external partners, to drive process optimization, failure analysis, and manufacturability improvements

Analyze reliability data and link it to in-line and end-of-line (EOL) metrics to enable early issue detection, continuous improvement, and yield enhancement

Establish Design-for-Packaging and Design-for-Reliability (DfX) guidelines, translating backend and reliability learnings into design rules and PDK updates. Together with Design Enablement team ensure the implementation.

Drive yield improvement by connecting packaging and reliability performance with process and test data across the value chain

Lead integration projects, ensuring timely delivery, clear communication, and adherence to technical specifications

Job requirements

Proven experience in semiconductor manufacturing, with a focus on InP photonic integration, backend processing, PIC packaging, and/or reliability. Hands-on experience in process development, optimization, and troubleshooting.

A Master’s degree or PhD in Integrated Photonics, Electrical Engineering, Materials Science, Physics, or related field.

Demonstrated ability to analyze reliability and process data, linking in-line and end-of-line (EOL) metrics to drive yield improvement and root cause analysis

Experience with Design-for-Packaging and/or Design-for-Reliability (DfX), including translating learnings into design rules or PDK improvements

Strong communication skills to work effectively in a cross-functional team environment.

Familiarity with software for design of PICs such as Klayout, Nazca, Luceda or similar.

We offer:

A collaborative atmosphere with talented, passionate colleagues within an open culture;

Personalized career development, including training and coaching opportunities. Notable trainings are JePPIX courses, Green/Black Belt in DfSS and Six Sigma or Project Management;

For people who need a work permit, VISA and/or relocation, we are eligible to apply for the highly skilled migrant VISA. We also have a relocation package in place.